Skip to main content

Location
Engineering 1, Rm 124

Description
The AJA ATC 2200-V is a versatile physical vapor deposition (PVD) system designed for a wide range of thin film applications. It features a load-locked chamber, turbo molecular pumping, and multiple circular magnetron sputtering sources with in-situ source head tilting. This allows for precise and repeatable confocal, direct, and off-axis thin film deposition configurations. The system supports DC sputtering and offers optional substrate heating for enhanced film properties.

Key features include adaptive pressure control for consistent process conditions and a heavy-duty hoist mechanism for safe and convenient access to the main chamber.

Configuration/Specifications
Six guns with 2-inch target capability
Six DC power supplies, each with a maximum output of 500 W
One RF power supply for precise and controlled RF energy in plasma processing applications
Available process gases: Ar, N2, Ar/H2 and Ar/O2.
Use of toxic materials is prohibited in this system

Substrate size
4″ substrates

Make
AJA International

Model
ATC 2200-V

Rate
CECS Tier-3